Techspray Eco-Stencil UM - 1 qt MOQ CASE/12 - 1570-QT

Effectively removes all types of solder paste (e.g. water­based, RMA, no­clean, lead­free) and uncured adhesive from screens, misprinted boards and equipment. Completely safe on stencils, squeegees, and equipment surfaces. Ideal replacement for IPA cleaners, which are often prohibited because of safety and environmental restrictions on VOC emissions or waste disposal issues.
Features & Benefits

• Quickly clean paste or uncured adhesive
• Safe for stencils, tools, misprinted boards
• Nonflammable
• Low VOC, zero GWP
• Non-ozone depleting
• Compatible with DEK Nano-ProTek coating

Applications

• Manual stencil tool, work surface, and squeegee cleaning
• Automatic underside wipe stencil cleaning
• Batch ultrasonic cleaning
• Removes unsoldered leaded & lead-free solder pastes
• Cleans off uncured adhesives

Categories: PCB Assembly Cleaners, Wipes, Wipes - Presaturated, Techspray Renew
Applications: Immersion / Bucket Cleaning, Electronic Assembly, Soldering / Desoldering, Ultrasonic Cleaner, SMT / Wave Soldering Cleaning, Isopropyl Alcohol (IPA) Alternatives (115)
Units Per Case: MOQ CASE/12