Chemtronics Soder-Wick Rosin - 50-2-500

Soder-Wick offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.

• Soder-Wick Rosin 5' and 10' spools packaged in ESD-safe static dissipative bobbins
• Minimizes the risk of damage associated with static electricity
• Noncorrosive ultra high purity Type R rosin flux
• Minimizes the risk of heat damage to the board
• Will not leave ionic contamination on the boards

• Soder-Wick Rosin safely removes solder in all applications requiring Type ROL0 rosin flux
• BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

• MIL-F-14256 F type R flux
• NASA-STD-8739.3 Soldered Electrical Connections
• DOD-STD-883E, Method 2022
• ANSI/IPC J STD-004, Type ROL0