Description

Chem-Wik Desoldering Braid ensures fast and safe desoldering with ultra-pure, oxygen-free copper braid that quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage.

All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.


Features:
  • Chem-Wik Rosin 5' spools packaged in ESD-safe static dissipative bobbins
  • Requires little or no post solder cleaning, no corrosive residues
  • Optimized weave design for faster wicking and heat transfer
  • Halide free
  • Coated with ultra high purity, noncorrosive Type R rosin flux
  • Quickly and thoroughly removes solder
  • Fast wicking action protects components from harmful heat damage
Applications
  • Chem-Wik Rosin desoldering braid safely removes solder from:
  • Thru-hole Components
  • Surface Mount Device Pads
  • BGA Pads
  • Micro Circuits
  • Terminals
  • Lugs and Posts
  • Identification Script
Specifications
  • MIL-F-14256F Type R
  • NASA STD-8739.3 Soldered Electrical Connections
  • ANSI/IPC J STD-004, Type ROL0
  • DOD-STD-883E, Method 2022

Categories: Desoldering Braid (Wick), Chem-Wik
Applications: PCB Repair & Prototyping
Units Per Case: 12 cans