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Dow DOWSIL Q3-6575 Dielectric Gel Clear 0.9 kg Kit - PFQ3657501 $177.99

Dow SYLGARD 184 Silicone Encapsulant Clear 0.5 kg Kit - 184 SIL ELAST KIT 0.5KG

$175.53
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SKU: 184 SIL ELAST KIT 0.5KG
California prop 65
Description

Description

The SYLGARD™ 184 Silicone Encapsulant Clear is a two‐component kit with a 10:1 mix ratio designed for room temperature or heat curing. This clear, flowable elastomer is intended for use as a protective coating or encapsulant for applications such as LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. Kit size is 0.5 kg, and additional sizes (3.9 kg, 19.9 kg) are available. It provides flowability, flame resistance, and good dielectric properties. Typically ships in 1-2 business days.

Key Features

  • Two‐Component System: 10:1 mix ratio for easy and accurate preparation.
  • Clear, Flowable Silicone Elastomer: Easy to apply and inspect encapsulated components.
  • Flexible Curing Options: Room temperature or heat cure capability.
  • Designed for Electronics Encapsulation: Ideal for LED lighting, sensors, transformers, power supplies, and connectors.
  • Flame Resistance & Dielectric Performance: Provides protection and reliability in harsh environments.
  • Available Size: 0.5 kg kit, with additional sizes of 3.9 kg and 19.9 kg available.

Applications

  • LED Lighting Circuits: Ideal for encapsulating LED components and ensuring protection.
  • Power Supply Potting: Provides robust protection for power supplies and other sensitive components.
  • Sensor & Amplifier Protection: Helps protect delicate sensors and amplifiers in demanding environments.
  • Connector Encapsulation: Encases connectors and industrial control assemblies for enhanced durability.
  • General Electronics Protection: Provides reliable protection in industrial electronics applications.

Benefits

  • Flexible Curing Options: Room or heat curing to accommodate various manufacturing processes.
  • Clear Formulation: Allows for easy visual inspection of encapsulated components.
  • Flowable Material: Simplifies dispensing into complex assemblies and cavities.
  • Flame Resistance & Dielectric Properties: Enhances product reliability and performance in harsh environments.

Product Specs

  • Brand: SYLGARD
  • Color: Clear
  • Components: 2 parts
  • Cure System: Room temperature / Heat
  • Cure Time: 45 min @ 100 °C
  • Dielectric Strength: 350 V/mil
  • Flash Point: 101 °C
  • Hardness: 48 A
  • Mix Ratio: 10:1
  • Service Temperature: -45 to 200 °C
  • Specific Gravity: 1.03
  • Thermal Conductivity: 0.16 W/mK
  • Viscosity: 3,500
  • Volume Resistivity: 2.9 × 10¹⁴ ohm-cm
  • Working Time: >2 h @ room temperature

Categories

  • Silicone Encapsulants
  • Electronic Protection Materials
  • Potting & Encapsulation Kits
  • Industrial Electronics Materials
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FAQs

What is SYLGARD 184 Silicone Encapsulant, and when should it be used?

SYLGARD 184 is a clear, two-component silicone encapsulant (10:1 mix ratio) designed for protecting electronic assemblies like LEDs, sensors, power supplies, connectors, and transformers. It provides a flexible elastomeric encapsulation with good dielectric and flame-resistant properties.

What are the curing options and times for this kit?

The encapsulant can cure at room temperature (~48 hours at ~25 °C) or can be heat-accelerated, around 35 minutes at 100 °C, 20 minutes at 125 °C, and 10 minutes at 150 °C.

What performance characteristics apply once the material is cured?

Cured SYLGARD 184 offers dielectric strength approx. 19 kV/mm, volume resistivity around 2.9 ×10¹⁴ ohm-cm, service temperature range from about -45 °C to 200 °C, and the material is optically clear for visual inspection.

How should the material be mixed and processed for the best results?

Mix the base and curing agent at a 10:1 ratio by weight or volume, ensure thorough dispersion, remove entrapped air (vacuum degas if needed), then pour or dispense. Minimize air entrapment and ensure substrates are clean and dry for optimal adhesion.

Are there any compatibility or limitations to be aware of?

Yes, certain substrates and materials may inhibit cure or reduce performance (e.g., materials containing sulfur compounds, organotin catalysts, some plasticizers). Thermal performance at extreme ends (very low or very high temperatures) may need validation for your specific application.