Description

Chemask NA Non-Ammoniated Solder Masking Agent is a latex and ammonia free, fast curing, peelable temporary spot mask formulated for safe use on sensitive metals. It contains high-temperature resistant compounds that protect component-free areas during wave soldering. Chemask NA may be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes.


Features:
  • Will not affect gold, copper, nickel, silver and OSP finishes
  • For lead-free or tin/lead processes
  • Stable to 550º F (288ºC)
  • Phthalate-free, low toxicity and environmentally safe
  • Compatible with rosin, no-clean and water soluble flux types
  • Dries tack free in 15 minutes
  • Can be placed directly into pre-heat oven without waiting
  • Removes easily and leaves no residue
  • Non-contaminating, non-staining and noncorrosive
  • RoHS compliant
Applications
  • Engineered for use with bare copper, silver, and other reactive metals
  • Ideal for SMT applications

Categories: Solder Mask, Chemask
Units Per Case: 12 blister packs