Dymax E-MAX 904-SC UV Curing Adhesive Gel Blue 30 mL Syringe - E-MAX 904-GEL-SC 30ML MR S

$77.01
SKU: E-MAX 904-GEL-SC 30ML MR S
Categories:  Adhesives ,Adhesives by Dymax ,
Description

Description

Dymax E-MAX 904-SC is a one-component, blue UV curing adhesive gel designed for electronic assembly applications. This acrylated urethane adhesive cures with UV light or at room temperature and is used for shock absorption, reinforcing, and bonding components on printed circuit boards.
It is supplied in a 30 mL syringe and is available with tiered pricing options. The material is formulated as a non-slumping gel to support PCB assembly processes.

Key Features

• One-component adhesive

• UV light and room-temperature curing

• Acrylated urethane gel formulation

• Blue, non-slumping gel

• Designed for PCB component bonding

• Supports shock absorption and reinforcing


Applications

• Bonding components on printed circuit boards

• Shock-absorbing gel for electronic assemblies

• Reinforcing materials on PCBs


Benefits

• Provides secure reinforcement for PCB components

• Cures quickly under UV light

• Offers room-temperature curing capability

• Single-component format simplifies application


Product Specs

Brand E-MAX
Chemical Composition Acrylated urethane
Color Blue
Components 1 part
Cure System UV
Elongation 170% @ break
Flash Point 101 °C
Viscosity 37,000

Categories

• UV Curing Adhesives

• Dymax Products

• Electronic Assembly Adhesives

• PCB Bonding Materials

Reviews

FAQs

What is this adhesive gel designed for?

E-MAX 904-SC is a one-component, blue gel adhesive made from acrylated urethane. It is tailored for electronic assembly applications, especially for bonding, reinforcing, and shock-absorbing components on printed circuit boards (PCBs). Its gel form helps reduce flow after dispensing for precise placement.

How does the curing process work?

This adhesive cures either by UV/visible light exposure or by room-temperature ambient cure. The blue gel turns clear when fully cured, allowing visual confirmation. Cure speed depends on thickness, lamp intensity, and substrate light transmission.

What are the key mechanical and electrical properties?

In cured form, the material has a density of about 1.14 g/mL; a tensile strength around 2,300 psi (16 MPa); elongation around 170 %; dielectric constant ≈6.04; and volume resistivity ~1.48×10¹⁵ ohm-cm.

What does “non-slumping gel” mean, and why is it important?

“Non-slumping gel” means that after dispensing, the adhesive stays where placed and does not spread or flow. This is critical in PCB assembly, where precise placement around components is needed and any movement could compromise the bond or contaminate nearby parts.

What surface prep and handling considerations apply?

Ensure substrates are clean, free of flux, grease, or mold release. Minimize ambient light exposure prior to curing, and store resin in cool, dark conditions because exposure to light may prematurely polymerize the product. Use UV-blocking equipment for dispensing lines.