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Dow SYLGARD 184 Silicone Encapsulant Curing Agent Clear 20.4 kg Pail - 184 CURING AGENT 20.4KG PL

$3,609.03
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SKU: 184 CURING AGENT 20.4KG PL
California prop 65
Description

Description

SYLGARD™ 184 Silicone Curing Agent is the curing component of a two-component, flowable silicone system. It is designed to be used with the SYLGARD 184 base to produce a flexible encapsulant for electrical and electronic applications.
The material offers good dielectric properties and flame resistance and can be cured at room temperature or with heat. Typical uses include LED lighting, power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high-voltage resistor packs, relays, solar cells, and beam lead integrated circuits.
This version is supplied as a clear curing agent packaged in a 20.4 kg pail. The product is in stock and usually ships in 1–2 business days.

Key Features

• Curing agent for SYLGARD 184 system

• Two-component silicone encapsulant system

• Room temperature and heat-cure capability

• Good dielectric properties

• Flame resistant

• Clear formulation


Applications

• LED lighting

• Power supplies

• Connectors

• Sensors

• Industrial controls

• Transformers

• Amplifiers

• High-voltage resistor packs

• Relays

• Solar cells

• Beam lead integrated circuits


Benefits

• Supports flexible silicone encapsulation

• Provides reliable dielectric performance

• Offers flame-resistant properties

• Suitable for a wide range of electronic and electrical assemblies


Product Specs

Brand SYLGARD
Chemical Composition Silicone
Color Clear
Components 2 part
Cure System Room Temperature / Heat
Cure Time 48 h @ 25 °C
35 min @ 100 °C
20 min @ 125 °C
10 min @ 150 °C
Dielectric Strength 19 kV/mm
Flash Point >101.1 °C
Mix Ratio 10:1
Service Temperature -45 to 200 °C
Specific Gravity 1.03
Tensile Strength 980 psi
Thermal Conductivity 0.27 W/mK
Viscosity (Mixed) 3500
Volume Resistivity 2.9 × 10¹⁴ ohm-cm
Working Time 1.5 h @ 25 °C

Categories

• Encapsulants

• Silicone Materials

• Dow Products

• Electronic Assembly Materials

Reviews

FAQs

What is SYLGARD 184 Silicone Curing Agent used for?

This curing agent is part of the two-component SYLGARD 184 silicone encapsulant system. When mixed with the base at a 10:1 ratio, it produces a flexible, durable encapsulant used to protect electronic assemblies such as LEDs, sensors, transformers, power supplies, and high-voltage components.

How does the curing process work?

The material can cure at room temperature or be accelerated with heat. Typical cure times include 48 hours at 25 °C or as fast as 10–35 minutes at elevated temperatures between 100–150 °C. This flexibility allows manufacturers to match curing speed to production requirements and thermal limits of components.

What performance advantages does the cured SYLGARD 184 material offer?

The encapsulant provides strong dielectric properties, flame resistance, and mechanical flexibility. With a dielectric strength of around 19 kV/mm, it protects sensitive circuits, resists environmental stress, and withstands service temperatures from –45 °C to 200 °C. Its clarity is useful for optoelectronic assemblies like LED modules.

What are the mixing and handling requirements?

The curing agent must be mixed thoroughly with SYLGARD 184 base at a 10:1 ratio. Once mixed, the material has a working time of about 1.5 hours at room temperature. Proper mixing, degassing, and clean dispensing equipment help ensure consistent curing and optimal electrical and mechanical performance.

What packaging and shipping details should users know?

This product is supplied as a clear curing agent in a 20.4 kg pail and typically ships within 1–2 business days. It is intended for industrial and electronic assembly use. As with all silicone materials, users should follow standard storage, handling, and safety guidelines recommended by the manufacturer.