Click to enlarge
  • All Categories
  • Dow SYLGARD 184 Silicone Encapsulant Clear 3.9 kg Kit - 184 SIL ELAST KIT 3.9KG
Back to products Back to products

Dow SYLGARD 184 Silicone Encapsulant Clear 3.9 kg Kit - 184 SIL ELAST KIT 3.9KG

$775.99
Add to wishlist
Add to compare
SKU: 184 SIL ELAST KIT 3.9KG
California prop 65
Description

Description

SYLGARD™ 184 Silicone Encapsulant is a clear, two-component material designed for encapsulating and protecting electronic components. It uses a 10:1 mix ratio and can cure at room temperature or with heat.
Typical uses include LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. This product is supplied as a 3.9 kg kit and is usually available to ship within 1–2 business days. Additional sizes are offered for different application volumes.

Key Features

• Clear silicone encapsulant

• Two-component material

• 10:1 mix ratio

• Room temperature and heat cure capability

• Suitable for electronic component protection

• Available as a 3.9 kg kit


Applications

• LED lighting

• Power supplies

• Transformers

• Sensors

• Amplifiers

• Connectors


Benefits

• Provides protective encapsulation for electronics

• Supports flexible curing conditions

• Clear formulation for visual component inspection


Product Specs

Brand SYLGARD
Chemical Composition Silicone
Color Clear
Components 2 part
Cure System Room temperature / Heat
Cure Time 45 min @ 100 °C
Dielectric Strength 350 V/mil
Flash Point 101 °C
Hardness 48 A
Mix Ratio 10:1
Service Temperature -45 to 200 °C
Specific Gravity 1.03
Thermal Conductivity 0.16 W/mK
Viscosity 3,500
Volume Resistivity 2.9 × 10¹⁴ ohm-cm
Working Time >2 h @ room temperature

Categories

• Silicone Encapsulants

• Dow Products

• Electronic Materials

• Potting & Encapsulation Compounds

Reviews

FAQs

What is SYLGARD 184 Silicone Encapsulant and when is it used?

SYLGARD 184 is a two-component silicone encapsulant kit mixed at a 10:1 ratio. It cures at room temperature or with heat, creating a clear, flexible elastomer used for protecting electronics like LEDs, sensors, power supplies, and high-voltage components.

What are the curing options and times for this material?

Curing can be done at ambient temperatures (˜48 hours at 25 °C) or heat-accelerated (e.g., 35 minutes @100 °C, 20 minutes @125 °C, 10 minutes @150 °C) depending on part size and thermal constraints.

What performance characteristics does the cured encapsulant provide?

Once cured, the material offers excellent dielectric strength (~19 kV/mm), high resistivity (~2.9×10¹⁴ ohm-cm), flexible service over –45 °C to ~200 °C, and good flame resistance. It also has a viscosity ~3,500 cP when mixed and specific gravity ~1.03.

What mixing and processing should I follow for best results?

Mix the two components at a 10:1 ratio by weight or volume. Minimize air entrapment (deairing under vacuum is recommended for complex parts). Clean and prepare the substrate; in some cases, a primer may be required for adhesion.

Are there limitations or compatibility concerns I should know about?

Yes. Some substrates or materials, like those containing sulfur, organo-tin catalysts, or mobile plasticizers, may inhibit cure or adhesion. Also, while rated for –45 °C to 200 °C, extreme end-use conditions should be validated with testing.