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Dow DOWSIL™ TC-5622 Thermally Conductive Adhesive Compound 1 kg - TC-5622 TC COMPOUND 1KG
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Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Adhesive Gap Filler 720 g Kit - TC-5515 LT GAP FILLER 720G KIT

$71.03
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SKU: TC-5515 LT GAP FILLER 720G KIT  Adhesives,Adhesives by Dow,
California prop 65
Description
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Adhesive Gap Filler 720 g Kit
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.
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