• Thermal bonding. Dow DOWSIL 1-4173 TC Thermally Conductive Adhesive Gray is a one-component, solvent-free adhesive used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat-curing, self-leveling, and flowable, with good thermal conductivity and high tensile strength. This syringe is a Dow product repackaged by KitPackers.
  • Performance profile. Dow characterizes 1-4173 as a one-part, gray, flowable thermally conductive adhesive with high tensile strength. Its self-leveling nature helps it form an even layer, while its thermal conductivity conducts heat from components to heat sinks, housings, or base plates.
  • Durability. Distributor data notes 1-4173 provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental contaminants, supporting durable bonds in demanding electronics. As a solvent-free silicone with a ceramic filler, it forms a robust thermal and mechanical bond on cure.
  • Handling notes. As a heat-cure adhesive, the material is cured by applying heat, giving controlled processing. The 30 mL syringe is well-suited for precise, small-scale dispensing and rework. Review the product and Safety Data Sheets and confirm the cure schedule before production use.

Recommended For

  • Bonding electronic components
  • Attaching housings, lids, and base plates
  • Bonding heat sinks
  • Applications needing high tensile strength and thermal transfer
  • Precise, small-scale dispensing and rework

Product Details

  • Product type: One-part solvent-free thermally conductive silicone adhesive
  • Color: Gray
  • Cure: Heat cure
  • Key properties: Self-leveling, flowable, good thermal conductivity, high tensile strength
  • Filler: Ceramic-filled silicone polymer (per distributor data)
  • Packaging: Repackaged by KitPackers; 30 mL syringe

Primary Industries

  • Electronics and PCB manufacturing
  • Thermal management and heat-sink bonding
  • Consumer and industrial electronics
  • Module and housing assembly

Standards and Certifications

  • None specified by source

FAQs