Key Performance Benefit: One component, heat curing silicone adhesive designed to cool electronic applications while providing strong bonding to metals, ceramics, filled plastics, epoxy laminates, and organic substrates.
Material & Construction: One-part silicone formulation; heat curing; gray color; self-leveling, flowable, thixotropic; contains no added solvents; specific gravity 2.6 @ 25 °C; viscosity 81,000.
Risk Reduction/Compliance Benefit: Flame resistant formulation; no added solvents; designed for bonding applications requiring flexibility and thermal conductivity.
Protection Level: Thermal conductivity 1.8 W/mK; dielectric strength 400 V/mil; service temperature range -45 to 200 °C; flash point >100 °C.
Comfort & Usability: Supplied in 30 cc syringe; cure time 40 min @ 100 °C, 10 min @ 125 °C, 3 min @ 150 °C; self-leveling and flowable consistency; thixotropic properties support controlled application.
Key Performance Benefit: One component, heat curing silicone adhesive designed to cool electronic applications while providing strong bonding to metals, ceramics, filled plastics, epoxy laminates, and organic substrates.
Material & Construction: One-part silicone formulation; heat curing; gray color; self-leveling, flowable, thixotropic; contains no added solvents; specific gravity 2.6 @ 25 °C; viscosity 81,000.
Risk Reduction/Compliance Benefit: Flame resistant formulation; no added solvents; designed for bonding applications requiring flexibility and thermal conductivity.
Protection Level: Thermal conductivity 1.8 W/mK; dielectric strength 400 V/mil; service temperature range -45 to 200 °C; flash point >100 °C.
Comfort & Usability: Supplied in 30 cc syringe; cure time 40 min @ 100 °C, 10 min @ 125 °C, 3 min @ 150 °C; self-leveling and flowable consistency; thixotropic properties support controlled application.
