FAQs
What applications is this DOWSIL thermally conductive adhesive designed for?
This DOWSIL one component heat curing silicone adhesive is designed for electronic cooling and bonding applications. It is commonly used to attach power semiconductor devices, hybrid circuit substrates, and components to heat sinks while providing both mechanical adhesion and efficient heat transfer.
How does this adhesive manage heat in electronic assemblies?
With a thermal conductivity of 1.8 W/mK, the adhesive helps transfer heat away from critical components to cooling surfaces. Its stable silicone formulation maintains performance across a service temperature range of −45 to 200 °C, supporting demanding thermal cycling conditions.
What materials can this adhesive bond to?
This adhesive bonds effectively to metals, ceramics, filled plastics, epoxy laminates, and other organic substrates. Its silicone chemistry provides strong adhesion while maintaining flexibility, making it suitable for assemblies exposed to vibration, expansion, and contraction during operation.
How is the adhesive applied and cured?
The adhesive is supplied as a one part formulation in a syringe for controlled dispensing. It cures with heat, requiring 40 minutes at 100 °C, 10 minutes at 125 °C, or 3 minutes at 150 °C, depending on processing needs.
What performance properties support reliability?
This adhesive offers dielectric strength of 400 V/mil, hardness of 87 Shore A, tensile strength of 545 psi, and shear strength of 540 psi. It is flame resistant, contains no added solvents, and features a self-leveling, thixotropic consistency for consistent application.
