Key performance benefit: One component, heat curing silicone adhesive designed to cool electronic applications while providing strong bonding to metals, ceramics, filled plastics, epoxy laminates, and organic substrates.
Material & construction: One-part silicone formulation; heat curing; gray color; self-leveling, flowable, thixotropic; contains no added solvents; specific gravity 2.6 @ 25 °C; viscosity 81,000.
Risk reduction / compliance benefit: Flame resistant formulation; no added solvents; designed for bonding applications requiring flexibility and thermal conductivity.
Protection level: Thermal conductivity 1.8 W/mK; dielectric strength 400 V/mil; service temperature range -45 to 200 °C; flash point >100 °C.
Comfort & usability: Supplied in 30 cc syringe; cure time 40 min @ 100 °C, 10 min @ 125 °C, 3 min @ 150 °C; self-leveling and flowable consistency; thixotropic properties support controlled application.
Applications requiring flexibility and thermal conductivity
Product Details
Brand: DOWSIL
Product Type: Thermally Conductive Adhesive
Color: Gray
Components: 1 Part
Packaging: 30 cc Syringe
Cure Time: 40 min @ 100 °C; 10 min @ 125 °C; 3 min @ 150 °C
Thermal Conductivity: 1.8 W/mK
Dielectric Strength: 400 V/mil
Service Temperature: -45 to 200 °C
Hardness: 87 A
Elongation: 15%
Tensile Strength: 545 psi
Shear Strength: 540
Specific Gravity: 2.6 @ 25 °C
Flash Point: >100 °C
Viscosity: 81,000
Primary Industries
Electronics Manufacturing
Semiconductor
Electronic Assembly
Standards and Certifications
Flame Resistant
No Added Solvents
FAQs
What applications is this DOWSIL thermally conductive adhesive designed for?
This DOWSIL one component heat curing silicone adhesive is designed for electronic cooling and bonding applications. It is commonly used to attach power semiconductor devices, hybrid circuit substrates, and components to heat sinks while providing both mechanical adhesion and efficient heat transfer.
How does this adhesive manage heat in electronic assemblies?
With a thermal conductivity of 1.8 W/mK, the adhesive helps transfer heat away from critical components to cooling surfaces. Its stable silicone formulation maintains performance across a service temperature range of −45 to 200 °C, supporting demanding thermal cycling conditions.
What materials can this adhesive bond to?
This adhesive bonds effectively to metals, ceramics, filled plastics, epoxy laminates, and other organic substrates. Its silicone chemistry provides strong adhesion while maintaining flexibility, making it suitable for assemblies exposed to vibration, expansion, and contraction during operation.
How is the adhesive applied and cured?
The adhesive is supplied as a one part formulation in a syringe for controlled dispensing. It cures with heat, requiring 40 minutes at 100 °C, 10 minutes at 125 °C, or 3 minutes at 150 °C, depending on processing needs.
What performance properties support reliability?
This adhesive offers dielectric strength of 400 V/mil, hardness of 87 Shore A, tensile strength of 545 psi, and shear strength of 540 psi. It is flame resistant, contains no added solvents, and features a self-leveling, thixotropic consistency for consistent application.
