FAQs
What is DOWSIL 3145 Adhesive?
DOWSIL 3145 is a one-component, room-temperature curing (RTV) silicone adhesive/sealant. It features a non-flowing paste formulation, designed to bond and seal housings, modules, printed wiring boards, and electrical leads without the need for mixing or oven curing.
What key performance properties does it provide?
This adhesive offers high tensile strength (~1,035 psi or 7.1 MPa), excellent elongation (~670 %), and enhanced thermal stability across a wide service temperature range. It cures to a Shore A hardness around 51 and has a specific gravity roughly 1.12 when cured.
What operating temperature range is supported?
For most applications, DOWSIL 3145 can be used from approximately -45 °C to +200 °C (-49 °F to +392 °F) for extended use. At the high end, performance will vary with time and exposure at elevated temperature.
What are the application and installation considerations?
Ensure substrates are thoroughly cleaned and degreased (e.g., with naphtha, mineral spirits) and lightly abraded when feasible. This adhesive doesn’t require mixing — simply dispense and allow to cure in ambient humidity (30–80 % RH). Full properties are typically achieved within 24–72 hours at room temperature.
Are there any limitations or special notes?
Yes — while excellent for many reactive metals, ceramics, glass and some plastics, adhesion may be poor on non-reactive materials like Teflon, polyethylene or polypropylene unless surface treatment or primer is used. Also, the product is not intended for continuous immersion in solvent or fuel environments without testing.
