$3,609.03
• Curing agent for SYLGARD 184 system
• Two-component silicone encapsulant system
• Room temperature and heat-cure capability
• Good dielectric properties
• Flame resistant
• Clear formulation
• LED lighting
• Power supplies
• Connectors
• Sensors
• Industrial controls
• Transformers
• Amplifiers
• High-voltage resistor packs
• Relays
• Solar cells
• Beam lead integrated circuits
• Supports flexible silicone encapsulation
• Provides reliable dielectric performance
• Offers flame-resistant properties
• Suitable for a wide range of electronic and electrical assemblies
| Brand | SYLGARD |
| Chemical Composition | Silicone |
| Color | Clear |
| Components | 2 part |
| Cure System | Room Temperature / Heat |
| Cure Time |
48 h @ 25 °C 35 min @ 100 °C 20 min @ 125 °C 10 min @ 150 °C |
| Dielectric Strength | 19 kV/mm |
| Flash Point | >101.1 °C |
| Mix Ratio | 10:1 |
| Service Temperature | -45 to 200 °C |
| Specific Gravity | 1.03 |
| Tensile Strength | 980 psi |
| Thermal Conductivity | 0.27 W/mK |
| Viscosity (Mixed) | 3500 |
| Volume Resistivity | 2.9 × 10¹⁴ ohm-cm |
| Working Time | 1.5 h @ 25 °C |
• Encapsulants
• Silicone Materials
• Dow Products
• Electronic Assembly Materials
$3,609.03
• Curing agent for SYLGARD 184 system
• Two-component silicone encapsulant system
• Room temperature and heat-cure capability
• Good dielectric properties
• Flame resistant
• Clear formulation
• LED lighting
• Power supplies
• Connectors
• Sensors
• Industrial controls
• Transformers
• Amplifiers
• High-voltage resistor packs
• Relays
• Solar cells
• Beam lead integrated circuits
• Supports flexible silicone encapsulation
• Provides reliable dielectric performance
• Offers flame-resistant properties
• Suitable for a wide range of electronic and electrical assemblies
| Brand | SYLGARD |
| Chemical Composition | Silicone |
| Color | Clear |
| Components | 2 part |
| Cure System | Room Temperature / Heat |
| Cure Time |
48 h @ 25 °C 35 min @ 100 °C 20 min @ 125 °C 10 min @ 150 °C |
| Dielectric Strength | 19 kV/mm |
| Flash Point | >101.1 °C |
| Mix Ratio | 10:1 |
| Service Temperature | -45 to 200 °C |
| Specific Gravity | 1.03 |
| Tensile Strength | 980 psi |
| Thermal Conductivity | 0.27 W/mK |
| Viscosity (Mixed) | 3500 |
| Volume Resistivity | 2.9 × 10¹⁴ ohm-cm |
| Working Time | 1.5 h @ 25 °C |
• Encapsulants
• Silicone Materials
• Dow Products
• Electronic Assembly Materials
