The SYLGARD™ 184 Silicone Encapsulant Clear is a two‐component kit with a 10:1 mix ratio designed for room temperature or heat curing. This clear, flowable elastomer is intended for use as a protective coating or encapsulant for applications such as LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. Kit size is 0.5 kg, and additional sizes (3.9 kg, 19.9 kg) are available. It provides flowability, flame resistance, and good dielectric properties. Typically ships in 1-2 business days.
Key Features
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Two‐Component System: 10:1 mix ratio for easy and accurate preparation.
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Clear, Flowable Silicone Elastomer: Easy to apply and inspect encapsulated components.
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Flexible Curing Options: Room temperature or heat cure capability.
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Designed for Electronics Encapsulation: Ideal for LED lighting, sensors, transformers, power supplies, and connectors.
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Flame Resistance & Dielectric Performance: Provides protection and reliability in harsh environments.
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Available Size: 0.5 kg kit, with additional sizes of 3.9 kg and 19.9 kg available.
Applications
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LED Lighting Circuits: Ideal for encapsulating LED components and ensuring protection.
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Power Supply Potting: Provides robust protection for power supplies and other sensitive components.
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Sensor & Amplifier Protection: Helps protect delicate sensors and amplifiers in demanding environments.
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Connector Encapsulation: Encases connectors and industrial control assemblies for enhanced durability.
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General Electronics Protection: Provides reliable protection in industrial electronics applications.
Benefits
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Flexible Curing Options: Room or heat curing to accommodate various manufacturing processes.
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Clear Formulation: Allows for easy visual inspection of encapsulated components.
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Flowable Material: Simplifies dispensing into complex assemblies and cavities.
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Flame Resistance & Dielectric Properties: Enhances product reliability and performance in harsh environments.
Product Specs
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Brand: SYLGARD
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Color: Clear
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Components: 2 parts
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Cure System: Room temperature / Heat
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Cure Time: 45 min @ 100 °C
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Dielectric Strength: 350 V/mil
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Flash Point: 101 °C
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Hardness: 48 A
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Mix Ratio: 10:1
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Service Temperature: -45 to 200 °C
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Specific Gravity: 1.03
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Thermal Conductivity: 0.16 W/mK
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Viscosity: 3,500
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Volume Resistivity: 2.9 × 10¹⁴ ohm-cm
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Working Time: >2 h @ room temperature
Categories
- Silicone Encapsulants
- Electronic Protection Materials
- Potting & Encapsulation Kits
- Industrial Electronics Materials
