$872.20
• Clear silicone encapsulant
• Two-component material
• 10:1 mix ratio
• Room temperature and heat cure capability
• Suitable for electronic component protection
• Available as a 3.9 kg kit
• LED lighting
• Power supplies
• Transformers
• Sensors
• Amplifiers
• Connectors
• Provides protective encapsulation for electronics
• Supports flexible curing conditions
• Clear formulation for visual component inspection
| Brand | SYLGARD |
| Chemical Composition | Silicone |
| Color | Clear |
| Components | 2 part |
| Cure System | Room temperature / Heat |
| Cure Time | 45 min @ 100 °C |
| Dielectric Strength | 350 V/mil |
| Flash Point | 101 °C |
| Hardness | 48 A |
| Mix Ratio | 10:1 |
| Service Temperature | -45 to 200 °C |
| Specific Gravity | 1.03 |
| Thermal Conductivity | 0.16 W/mK |
| Viscosity | 3,500 |
| Volume Resistivity | 2.9 × 10¹⁴ ohm-cm |
| Working Time | >2 h @ room temperature |
• Silicone Encapsulants
• Dow Products
• Electronic Materials
• Potting & Encapsulation Compounds
$872.20
• Clear silicone encapsulant
• Two-component material
• 10:1 mix ratio
• Room temperature and heat cure capability
• Suitable for electronic component protection
• Available as a 3.9 kg kit
• LED lighting
• Power supplies
• Transformers
• Sensors
• Amplifiers
• Connectors
• Provides protective encapsulation for electronics
• Supports flexible curing conditions
• Clear formulation for visual component inspection
| Brand | SYLGARD |
| Chemical Composition | Silicone |
| Color | Clear |
| Components | 2 part |
| Cure System | Room temperature / Heat |
| Cure Time | 45 min @ 100 °C |
| Dielectric Strength | 350 V/mil |
| Flash Point | 101 °C |
| Hardness | 48 A |
| Mix Ratio | 10:1 |
| Service Temperature | -45 to 200 °C |
| Specific Gravity | 1.03 |
| Thermal Conductivity | 0.16 W/mK |
| Viscosity | 3,500 |
| Volume Resistivity | 2.9 × 10¹⁴ ohm-cm |
| Working Time | >2 h @ room temperature |
• Silicone Encapsulants
• Dow Products
• Electronic Materials
• Potting & Encapsulation Compounds
