Chemtronics Soder-Wick No Clean - 60-2-10

SKU: 60-2-10  Chemtronics,Solder and Flux Remover
Description

Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.


Features:
  • Soder-Wick No Clean packaged in ESD-safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricity
  • Patented noncorrosive, halide free, organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
Applications
  • Soder-Wick No Clean SD safely removes solder in all applications requiring Type ROL0 flux
  • BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Specifications
  • MIL-F-14256 F
  • NASA-STD-8739.3 Soldered Electrical Connections
  • DOD-STD-883E, Method 2022
  • ANSI/IPC J STD-004, Type ROL0
  • Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
  • Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit

Categories: Desoldering Braid (Wick), Soder-Wick
Applications: PCB Repair & Prototyping
Units Per Case: 12 cans