Techspray NoClean desoldering braid (wick) does not leave behind ionic flux residues that can collect and form branches called “dendrites”. Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of your products.
Desoldering braid or desoldering wick is a pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder (e.g. bridging) to be removed. The soldering iron is applied to the wick as it sits on the solder joint, and when both are brought up to the solder's melting point, the flux is activated and, through capillary action from the braided design, solder is drawn up the wick. Techspray wick has been a mainstay at PCB rework, repair and prototyping stations for over 30-years.
Available in anti-static spools (marked with "AS") to prevent static build-up from damaging sensitive components.
Specifications: Meets or Exceeds MIL-F-14256, NASA NHB 5300, 4 (34-1), NASA NPC 200-4, NASA SP5002, IPC Standard-J-STD-004
Call-outs: Celestica (1821) 8690-0576, Celestica (1822) 8690-0588, Celestica (1823) 8690-0577, HP (1821) 8690-0588, HP (1823) HP 8690-0577
Size chart:
| Braid # |
Color Code |
Width (in) |
Width (mm) |
| #1 |
White |
0.035 |
0.9 |
| #2 |
Yellow |
0.055 |
1.4 |
| #3 |
Green |
0.075 |
1.9 |
| #4 |
Blue |
0.098 |
2.5 |
| #5 |
Brown |
0.130 |
3.3 |
| #6 |
Red |
0.193 |
4.9 |
Features & Benefits
- No-clean flux coated braid
- Cleanest wick - clear, non-reactive residues
- Will not leave ionic residue -- avoid dendrite failure
- Exceeds MIL-F-14256
Categories: Desoldering Braid
Applications: Electronic Repair, Soldering / Desoldering
Units Per Case: 25
