Used for periodic preventative maintenance to keep equipment running at top performance levels. Cleans reflow ovens, wave soldering systems, and associated heat exchanger systems by removing all types of flux residues (e.g. waterbased, RMA, noclean, leadfree). It is fast acting and more effective and safe than IPA for bakedon flux residues.
Features & Benefits
Categories: PCB Assembly Cleaners, Techspray Renew
Applications: Immersion / Bucket Cleaning, Electronic Assembly, Soldering / Desoldering, Ultrasonic Cleaner, SMT / Wave Soldering Cleaning, Isopropyl Alcohol (IPA) Alternatives (115)
Units Per Case: 1
Features & Benefits
- Quickly clean flux residue from oven & wave fingers
- Safe on warm ovens
- Nonflammable
- Low VOC, zero GWP
- Non-ozone depleting
- Removal of baked-on flux residues from SMT oven and wave equipment
- Maintenance cleaning for heat exchange systems (NOTE: rinse thoroughly from aluminum and copper)
- Finger cleaning in wave solder equipment
- Remove accumulated flux from wave solder pallets
Categories: PCB Assembly Cleaners, Techspray Renew
Applications: Immersion / Bucket Cleaning, Electronic Assembly, Soldering / Desoldering, Ultrasonic Cleaner, SMT / Wave Soldering Cleaning, Isopropyl Alcohol (IPA) Alternatives (115)
Units Per Case: 1
