Description
Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar
Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Jar.